Copper Bond Diamond Dry Polishing Pads HC-DPP-081
Ready to ship from our EU warehouse in Poland. Delivery options and charges are shown at checkout.
Technical highlights
- Wet / dry use
- Dry
Product overview
These HC-DPP-081 copper-bond diamond pads are listed for dry polishing of stone surfaces. Dry use is confirmed for this product. Compare the selected pad with the product images and your existing polishing equipment before ordering, because no universal machine interface is stated. Confirm the option required for the intended finishing stage before use.
Key Details
Check the selected option and product images before ordering.
Ordering & Delivery
Delivery options and return support are shown at checkout.





